6 edition of Electroless and other nonelectrolytic plating techniques found in the catalog.
Electroless and other nonelectrolytic plating techniques
J. I. Duffy
|Statement||edited by J.I. Duffy.|
|Series||Chemical technology review ;, no. 171|
|Contributions||Ranney, Maurice William, 1934-|
|LC Classifications||TS662 .R35 Suppl.|
|The Physical Object|
|Pagination||xii, 366 p. :|
|Number of Pages||366|
|LC Control Number||80019494|
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ISBN: OCLC Number: Notes: Supplement to John McDermott's [i.e. M.W. Ranney's] Electroless plating and coating of metals, Purchase Electroless Plating - 1st Edition. Print Book & E-Book.
ISBNBook Edition: 1. Automatic semiconductor wafer plating system for up to 5 wafers. mm, mm and mm wafers are plated with ENiPIG process.
Fully robotic transfer include Author: Wet Process by SPEC. DIY Brick Rocket Stove - Cooking Without Power - Duration: Live Simple, Live Free - Tinyhouse Prepper Recommended for you. The electroless copper deposition process developed in this study may open up a new route of plating on plastics (POP) for printed circuit boards, electromagnetic interference shielding, and.
Electroless Plating – Its Applications in Resistor Technology Article (PDF Available) in Electrocomponent Science and Technology 3(2) September .